Preparation of SiCp/A356 electronic packaging materials and its thixo-forging

WANGKai-kun(王开坤),KANGYong-lin(康永林),SONGPu-guang(宋普光),XUFeng(徐 峰),LIXian-hui(黎先辉)

Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (Special 3) : 988-992.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2010, Vol. 20 ›› Issue (Special 3) : 988-992.
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Preparation of SiCp/A356 electronic packaging materials and its thixo-forging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2010, 20(Special 3): 988-992

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